A series of annual international meetings
hosted by Tsinghua University, Beijing, China

September 24-25, 2018
Conference Language: English

Hosted by: Tsinghua University
Supported by: UNESCO International Center for Engineering Education

Platinum Industry Sponsor and Series Sponsor

 
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An Emerging Hub of Modern Engineering Education Innovation

 

Host institution and the global dialog

Tsinghua University in Beijing is consistently one of the highest ranked universities in the world and considered at the forefront of the Chinese university system. In addition to the core international dialog, visiting participants will meet and engage with key members of the Chinese academic leadership and faculty peers. The interconnection among nations is becoming more sophisticated and complex, and this Forum is a reflection of the host institution’s vision of a stronger spirit of collaboration and innovation among the progressive engineering educators from many different countries. Through informative presentations, tours, and networking sessions, visitors will experience the Chinese perspective and how it can relates to and benefit other regions.

 
 

Together, we can transform the way we prepare tomorrow’s engineering leadership

 The mandate of the Forum is to develop innovative, and practical strategies for responding to the immense educational challenges posed by emerging technological movements such as cyberphysical systems IoT, Industry 4.0, machine intelligence, and artificial intelligence.

Dynamic meeting format

Direct engagement and open dialog, dynamic mix of academic and industry leaders, technology integrated sessions, and extensive networking opportunities, makes the IEEC Forum a unique opportunity to meet and collaborate with education change-makers from China and around the world.

The end objective is to produce meaningful ideas and roadmaps for global engineering education innovation. Accordingly, the program is a strong departure from traditional academic meetings. Formal presentations will be compact, impactful, and challenging, and the open dialog will be vigorous. Additionally, the invited speakers and session leaders will include senior representatives from some of the most progressive industries at the forefront of the emerging fourth industrial revolution.

All participants will be a contributing member in an important global dialog on transforming the way we think, plan, and execute the development of tomorrow’s global engineer. It is essential that your institution participate in this important inaugural event.

 

Program Details

 

Challenge themes

The Forum will focus on three principal challenge themes and each theme will be framed by discussions and activities that will catalyze effective discussion. The challenge themes are:

1.       Technical and technology challenges for a smart, connected planet: What are the essential technical hurdles? What is industry asking for? What available and emerging technologies will be essential for success?

2.       Challenges in curriculum transformation: Can the traditional structure and methods work? What are the best practices and best emerging ideas? Are these new directions practical?

3.       Overcoming regional imbalance and fueling global collaboration: Can the new technologies and thinking trigger true, balanced, global entrepreneurship? What are the key differences and similarities among the regions?

Forum Organizing Committee

Dr. Jianbin Luo    
Dean of School of Mechanical Engineering, Tsinghua University
IEEI Forum Co-Chair

Dr. Sunyu Wang
Deputy Director & Secretary General of ICEE
IEEI Forum Co-Chair

Mr. Paul Gilbert
Chief Executive Officer, Quanser
IEEI Forum Co-Chair
 

 
 

Dr. Jianbin Luo
Dean of School of Mechanical Engineering
Tsinghua University, China

Dr. Ishwar Puri
Dean of Engineering
McMaster University, Canada

Dr. Richard T. Schoephoerster
Professor and Dean of College of Engineering
American University of Sharjah, UAE

 

Dr. Natacha DePaola
GEDC Chair                                                                Carol and Ed Kaplan Armour Dean of Engineering
Illinois Institute of Technology, USA

Dr. Janusz Kozinski
Founding President & Chief Executive
New Model in Technology & Engineering (NMiTE), UK

Additional speakers to be confirmed

 
 

Date: September 24-25, 2018
Conference Language: English

The Forum will be limited to 150 participants and will be on a first-come, first-served basis. The fee is $200 USD per participant. No student discounts available.

Venue, Accommodations & Travel Visa Requirements

All sessions will take place on the campus of Tsinghua University, Beijing. All meals and refreshments during the official forum hours are provided. More information to follow.

Discounted room rates have been reserved two Tsinghua University campus hotels - Jiasuo Hotel and Jinchunyuan Hotel. The cost is 598RMB per night (Approximately $100 USD per night.) 

If you require an invitation letter for entry into China or if you would like to make hotel reservations, please contact Josie Rahaman as soon as possible. 

Josie.Rahaman@quanser.com

 

 

We would like to thank the following sponsors for their generous support

 

Platinum Sponsor

 
 


Gold Sponsors

 


Silver Sponsors